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June 1998

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Subject:
From:
Mark Harrand <[log in to unmask]>
Reply To:
Mark Harrand <[log in to unmask]>
Date:
Thu, 4 Jun 1998 14:17:43 -0600
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TechNet Group,

I'm evaluating a low-melt Sn/Bi solder alloy for plastic BGA repair.  This
seems to work very well, but I need to learn about the interface between
Sn/Bi and the Sn/Pb solder (on the BGA and board).   Does anyone have
experience with this combination?

Thank you for any comments, suggestions, web links, etc that may provide
information.




Mark Harrand

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