Since I haven't seen any numbers yet, I'm sending this note with the
original request for information attached to it. If you are assembling PCBAs
that contain any of the following technologies, any ballpark numbers would
be appreciated:
*       25mil SMT connectors
*       16mil TQFPs (14mm package)
*       0402 chips

At this point, I don't care what (i.e. pad design, assembly tool set) is
behind the defect levels that you are seeing. I just want to see if I'm in
the right range.  If I'm not, then I'll take a good look at things before
ramping volume; otherwise, I'll ramp and fine-tune as I go.

Any numbers would be greatly appreciated.  If you are concerned about being
scrutinized with respect to your defect levels, please contact me directly.

----------------------------------------------------------------------------
-----------------------------
Original request:
At 15:59 29/05/98 -0400, you wrote:
> >Hi, we are planning to start assembling PCBAs with the following
> >technologies:
> >*       25mil SMT connectors
> >*       16mil TQFPs (14mm package)
> >*       0402 chips
> >
> >I'm interested in knowing what kind of placement/soldering defect levels
> are
> >associated with each of these packages.  Any help would be appreciated.
> >


Yves Trudell
Nortel, Wireless Networks Calgary
Quality System Engineering

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