TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Tamir Ben-Shoshan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Jun 1998 08:38:21 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
     Hi,
     There are two parameters that I should test before planning any press
     module for one of our application and hope getting some ideas from
     you:
     1. What is the tolerance received in the thickness of the QPFP100
        component after solder to the PC's pad?
     2. What is the maximum press stress can provide to the same soldered
        component before getting any mechanical failure both of the
        component's leads or joint.
     Thanks Tamir.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2