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June 1998

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Jun 1998 22:28:28 EDT
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Hi Pail,
There is no 'IPC shear test'. Solder joint reliability can NOT be determined
from 'pull and cross-section tests', they can however give an indication of
poor quality, specifically poor wetting. This poor quality of course would
lead to early failures, but indication of good quality is only a necessary,
but not sufficient requirement for solder joint reliability.
Given the large variability of lead and pad geometries, it is impossible to
set meaningful standards.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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