Folks,

I have been reviewing comments from past emails to the Technet forum
w.r.t. gold finishes on edge connectors.

I have concluded I should not require a nickel barrier for my application.
This could be qualified by noting the board will not be used in harsh
environments or be inserted more than several times in it's lifetime.

However I am still left wondering about the thickness of the hard gold
finish. In the past I have specified, for Class3, 1.3um. However, the
product shall be used in a class 2 environment.

Are there any disadvantages in using 1.3um (particularly since the IPC
standards state 0.8um for class 2), apart from cost?

Regards,

Colin Weber

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