Hi All,

I first want to thank John and Don for responding to my layer stack-up
question. I now have a question concerning the need for thermal reliefs
on a plane layer. I know that using thermals helps in creating a good
solder fillet on the component side of a leaded component, but I was
wondering how many designs are done without using them. Are there any PWB
assembly houses that can comment on their experiences with running boards
through a wave that doesn't contain thermals? A design that I am working
on will contain a ground plane on the bottom layer (solder side) and I'm
thinking that I might be able to get away without using thermals on it
because it will not be an internal layer and thus will be making direct
contact with the wave and not necessarily drawing off all of the heat
needed to produce a good solder joint up the lead of the component . I
will be using 2 oz. copper and have some high currents in certain areas
that would make not using thermals a benefit in designing the board. All
responses would be greatly appreciated.

Regards,
Bob Walker

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