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June 1998

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Subject:
From:
Benedicto Cruz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Jun 1998 11:05:06 +0000
Content-Type:
text/plain
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text/plain (36 lines)
Hi everyone,

I am using an epoxy dispensing machie that performs potting on metal
scases. One of my biggest problem is the occurrence of bubbles after
dispensing.
The machine has its own vacuum for the chemicals before mixing. But
the dispensing stage is done on room parameters. Bubbles occur before
and after oven curing.
Can this occurrence of bubbles be controlled? Or to we need a vacuum
verger during dispense?

I would also like to ask for the standard soldering iron temperature
used for rigid PCBs and flex PCBs.


 Regards.

Jon Cruz
OIC Supervising Product Engineer
Electronic Assemblies Inc.
[log in to unmask]
tel.# 823-7317/7593884
fax# 8238326

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