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June 1998

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Subject:
From:
Ricky Javier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Jun 1998 15:23:14 +0000
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 Hello everyone !

We are experiencing here some solder quality problem after our solder
reflow process. The quality of the solderability of components
spcecifically the QFP IC's was not that good. The formation of the
solder fillet was convex on the IC leads which sometimes looks to be
grainy and sometimes it looks to be that the solder paste has
suddenly stop from flowing to its desired area. We already checked
the profile parameters of our reflow process and it is within the
specs limit of the solder paste that we are using. Do you think that
the thawing time of the solder paste have something to do with this
kind of problem ? Thank you in advance to anyone that could give a
solution to this problem.

Regards,
Ricky
Electronics Assemblies, Inc. Phils.

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