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June 1998

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Subject:
From:
Joseph Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Jun 1998 17:32:17 -0700
Content-Type:
text/plain
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text/plain (100 lines)
One reason for a tear drop or filleted land for BGAs is to help transition
the stress on the trace as it enters the pad allowing a wider entry point
for land defined BGA pads. The technique is commonly used to protect trace
to land interconnects in flex circuits.


>Patel wrote:
>
>> What is "Teardropping"? Please explain it with the pro's and con's.
>>
>> re,
>> ken patel
>>
>> At 11:12 AM 6/26/98 -0400, Kuczynski Michael wrote:
>> >Is anybody out there using "teardropping" on their BGA's footprints ?
>> >
>> >Any pro's/con's to doing this would be appreciated.
>> >
>> >Thanks In Advance,
>> >
>> >Michael Kuczynski       201-393-2122 (Phone)
>> >Allied Signal           201-393-6688 (Fax)
>> >688 Rt46E E/K4
>> >Teterboro NJ 07608
>> >[log in to unmask]
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>--
>                        Have a Golden Day,
>
>Paul Anderson
>[log in to unmask]
>http://www.amherst.com/
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