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June 1998

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Jun 1998 12:22:23 -0500
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If you have already done everything you can with wave parameters such as
preheat/speed/dwell/flux activity you now have a quandry with quality
assurance and possibly end users. You may want to approach it from the
same way you would prove integrity of an intrusive reflow/pin in paste
connection. If you cannot achieve acceptable volume per industry spec,
you need to assure quality/engineering/customer of a robust
physical/electrical connection. Begin by cross sectioning a variety of
connections on a few boards to get real average expected volume
measurements under your existing process and to show
consistency/repeatability. It will also show that the joint, though
minimal, has no hidden voids which would further reduce volume. You can
then take non-cross sectioned joints from the same boards and perform
pull testing to demonstrate physical integrity. Pull testing will
normally prove that either the pin breaks before the joint, or the whole
barrel will come out of the board with the pin. Rarely (I have never
seen) will the solder joint itself fail. Best of luck....

> -----Original Message-----
> From: Alan Kreplick [SMTP:[log in to unmask]]
> Sent: Friday, June 26, 1998 9:42 AM
> To:   [log in to unmask]
> Subject:      [TN] Thru-hole Reliability
>
> I have a board that is .250" thick with 34 layers with 1 and 2 oz.
> copper.  I
> have been able to achieve a 25-50% hole fill both by hand and wave
> soldering.
> The only component that is being soldered are sixty-four tantalum
> capacitors
> (assembled with a partial clinch).
>
> We normally follow IPC's 75% hole fill guideline.
>
> Is the solder connection reliable both electrically and mechanically
> (we build
> ATE products that do not require thermal cycles or vibration tests)?
>
> Is 25-50% of .250 (.062"-.125") hole fill more reliable than a 75%
> hole fill on
> a .060" board (.045 hole fill)?  I've used this argument to say that
> it is more
> reliable even though it does not meet the 75% hole fill criteria.
>
>
> Thanks for any help,
>
>
> Al Kreplick
> Sr. Mfg. Eng.
> Teradyne, Inc.
> 617-422-3726
>
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