We have been using the 75% rule on a .155" thick board for two years
of production with excellent results!
        This has been used on connectors and DC-DC's, hundreds of connections
per board.
        No problems in the field...
        [log in to unmask]

        -----Original Message-----
        From:   Alan Kreplick [SMTP:[log in to unmask]]
        Sent:   Friday, June 26, 1998 7:42 AM
        To:     [log in to unmask]
        Subject:        [TN] Thru-hole Reliability

        I have a board that is .250" thick with 34 layers with 1 and 2 oz.
copper.  I
        have been able to achieve a 25-50% hole fill both by hand and wave
soldering.
        The only component that is being soldered are sixty-four tantalum
capacitors
        (assembled with a partial clinch).

        We normally follow IPC's 75% hole fill guideline.

        Is the solder connection reliable both electrically and mechanically
(we build
        ATE products that do not require thermal cycles or vibration tests)?

        Is 25-50% of .250 (.062"-.125") hole fill more reliable than a 75%
hole fill on
        a .060" board (.045 hole fill)?  I've used this argument to say that
it is more
        reliable even though it does not meet the 75% hole fill criteria.


        Thanks for any help,


        Al Kreplick
        Sr. Mfg. Eng.
        Teradyne, Inc.
        617-422-3726

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