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June 1998

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Subject:
Soldermask flaking in immersion gold process -Reply
From:
bob metcalf <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Jun 1998 09:32:43 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (44 lines) 
Mr Baverstock, Morton Electronic Materials have a patented process for
LPI application for use in electroless Ni Au. We have had a great deal of
success using this process. If you would like to give me a call, I would be
happy to discuss the details with you.

Bob Metcalf
Morton Electronic Materials USA
714-730-8356

>>> Keith Baverstock <[log in to unmask]> 06/25/98 02:54am >>>
Can anyone help...

It is well known that LPI soldermask can be problematic when put through
immersion nickel/gold process.

What 'fixes' are being used?

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