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June 1998

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Subject:
From:
Alan Kreplick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Jun 1998 10:41:41 -0400
Content-Type:
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I have a board that is .250" thick with 34 layers with 1 and 2 oz. copper.  I
have been able to achieve a 25-50% hole fill both by hand and wave soldering.
The only component that is being soldered are sixty-four tantalum capacitors
(assembled with a partial clinch).

We normally follow IPC's 75% hole fill guideline.

Is the solder connection reliable both electrically and mechanically (we build
ATE products that do not require thermal cycles or vibration tests)?

Is 25-50% of .250 (.062"-.125") hole fill more reliable than a 75% hole fill on
a .060" board (.045 hole fill)?  I've used this argument to say that it is more
reliable even though it does not meet the 75% hole fill criteria.


Thanks for any help,


Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
617-422-3726

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