I wonder if anyone out there can help me with this problem.  We've
been observing multiple pinholes in the solder joints of SMT
components (0603 and 0805 resistors and caps) that were reflowed in a
batch reflow oven.  These parts are being reflowed on ceramic
hybrids.  The process flow is to print solder paste on the hybrids,
reflow the solder paste, apply some paste flux, place the components,
and then reflow the hybrids again.  (We use this process because we
may manufacture 100 or so of the ceramic substrates at once, but then
place components on only a few per day.)  Any idea why we getting
these pinholes?

Thanks for your help.

Brett Goldstein
EVI, Inc.

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