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June 1998

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Subject:
From:
Chris Hunt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Jun 1998 13:27:10 +0100
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Karl

Is there a contact at TI for the CIC material ?

Chris Hunt
NPL


>>Reply to your message of 26/06/98 13:15
>Robert,
>
>Copper Invar Copper (CIC) is a Texas Industries "foil" product for
>multi layer boards that was designed to give the resulting board a low
>CTE (coefficient of thermal expansion).  The copper is metallurgically
>roll bonded to both sides of a foil layer of Invar (a nickel iron
>alloy that has very low CTE).  Invar also has low thermal conductivity
>(much lower than copper).  Arlon (among others (not necessarily an
>endorsement :)) makes a laminate core material using CIC.  Resulting
>board CTE using CIC and polyimide are 9-12 ppm-C (compared to 16-18
>ppm-C for standard polyimide GI(J,L,N) boards).  Talk to your board
>vendors about processing concerns and cost.
>--
>Karl Sweitzer                     voice: 716.47.77546
>Eastman Kodak Company             pager: 716.25.33681
>800 Lee Road                        fax: 716.47.77293
>Rochester, NY 14650-3118         mailto:[log in to unmask]
>
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