Keith, further to our discussion, I would like to confirm the action items:
The reason for failure is due to insufficient soldermask thickness over
conductors. During my last visit, plating thickness control was
discussed.
To improve the current situation please do the following:
1) Mesh size use a 38 T screen for boards that require NiAu.
2) Compare the results / process consistency by evaluating a partial
cure process.
Cure boards for 30 minutes at 150C,  plate, and then cure for another 30
minutes.

With regard to plating process control, you may want to discuss this with
Barry, conductor heights in the range of 85 / +100 microns are difficult to
reliably encapsulate.

I have spoken to Tony Hunt, he will contact you shortly. In the meantime if
you would like to discuss further please give me a call.

Regards

Fred

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