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June 1998

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Subject:
Re: Reliability Risk related Electroless Nickel/immersion gold
From:
"(George Milad)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jun 1998 18:29:05 EDT
Content-Type:
text/plain
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text/plain (23 lines) 
Ken,
Gold may not be applied directly on copper in the electrolytic or immersion
plating mode. Gold diffuses into the copper readily.  Nickel is a diffusion
barrier and is nessecary to maintain solderability.
Occaisionally the Ni may skip a pad during processing, if the electroless Ni
process is not running in spec.  This will result in the "copper colored pad".
This is not  be an acceptable defect.
George Milad
LeaRonal Inc
Tel(516)868-8800

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