Scott,
        Don't know board finish, have to check with vendor. What's up
with Entek that I should know, you tease....

> -----Original Message-----
> From: Scott Martin [SMTP:[log in to unmask]]
> Sent: Thursday, June 25, 1998 4:38 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Poor Solderability on TSOPs
>
> Board finish? Let me guess.... Entek?
>
> -----Original Message-----
> From: McMonagle, Michael R. [mailto:[log in to unmask]]
> Sent: Thursday,June 25,1998 3:30 PM
> To: [log in to unmask]
> Subject: [TN] Poor Solderability on TSOPs
>
>
> I am looking for a little enlightenment with an issue that we have
> been
> seeing. We have SMT assemblies with poor solderability on TSOP and
> mini-QFP type devices. The solder appears to have incomplete reflow
> and/or grainyness to the joints. Everything else on the board such as
> chips, j-leads and standard QFPs look good, shiny and well wetted. We
> are using fresh aqueous paste (Alpha WS609) and a fairly standard
> profile. Is there some inverse relationship between component/lead
> mass
> and thermal absorption that I am missing here? Any inputs would be
> greatly appreciated.
>
> Mike McMonagle
> Process Engineering Supervisor
> K*Tec Electronics
>
> Mike McMonagle
> PCA Process Engineering Supervisor
> K*Tec Electronics
> 1111 Gillingham Lane
> Sugar Land, TX 77478
> 281-243-5639 Phone
> 281-527-1726 Pager
> 281-243-5539 Fax
>
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