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June 1998

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Subject:
From:
Scott Martin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jun 1998 15:37:52 -0600
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Board finish? Let me guess.... Entek?

-----Original Message-----
From: McMonagle, Michael R. [mailto:[log in to unmask]]
Sent: Thursday,June 25,1998 3:30 PM
To: [log in to unmask]
Subject: [TN] Poor Solderability on TSOPs


I am looking for a little enlightenment with an issue that we have been
seeing. We have SMT assemblies with poor solderability on TSOP and
mini-QFP type devices. The solder appears to have incomplete reflow
and/or grainyness to the joints. Everything else on the board such as
chips, j-leads and standard QFPs look good, shiny and well wetted. We
are using fresh aqueous paste (Alpha WS609) and a fairly standard
profile. Is there some inverse relationship between component/lead mass
and thermal absorption that I am missing here? Any inputs would be
greatly appreciated.

Mike McMonagle
Process Engineering Supervisor
K*Tec Electronics

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX 77478
281-243-5639 Phone
281-527-1726 Pager
281-243-5539 Fax

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