Experts, I am currently getting alot of failures at my functional tester.
At my post solder station, I am noticing strings of dross across the pins
of connectors.  We are having to dedross the pot daily....for a no-clean
process and inerted atmosphering, I think this is a bit extreme.  Once, an
operator managed to accidently put stencil cleaner in the flux....could
this cause a reaction unable to be corrected without dumping the pot and
cause excess dross.  I initially thought we had too much exhaust drawing
all nitrogen away from the wave.  Our flux manufacturer did analyis and has
determined that it's not the residues left which is causing my bridges at
functional.  Is a type 'C' solder analysis going to tell me anything of
significance to my problem from any of your experiences?  Any
suggestions????

Jason Smith
Process Materials Engineer
Lexmark Electronics

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