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June 1998

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jun 1998 11:57:35 -0500
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text/plain
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text/plain (184 lines)
Hey Jeff, how about posting the spreadsheet files for download? I can
never have enough tools for this kind of stuff....

> -----Original Message-----
> From: Jeff Hempton [SMTP:[log in to unmask]]
> Sent: Thursday, June 25, 1998 11:18 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] intrusive reflow and all
>
>      Ed,
>        I have 37 articles, a few power-point presentations, and 9
> different
>      spreadsheets I use for calculating intrusive reflow stuff. Now,
> we
>      could either spend half of our day at the fax machine, or give a
> quick
>      reference to some good and readily available resources that
> provide
>      good starter material.
>        You were correct when you stated the forum is about helping
> each
>      other, but let's keep it as painless as possible.
>        BTW, I have Jim Blankenhorn's book, and it comes with excel
>      spreadsheets.Regards!
>
>
> ______________________________ Forward Header
> __________________________________
> Subject: Re: [TN] intrusive reflow and all
> Author:  Eddie Brunker <[log in to unmask]> at Internet
> Date:    6/25/98 3:59 PM
>
>
> Now this is direct selling!!!
>
> Why are we reccommending some books to this man anyway, why don't we
> just
> help him out with the info. he needs. Isn't that what this forum is
> all about?
>
>
> At 09:28 25/06/98 -0500, you wrote:
> >We sell the Solberg and Blankenhorn books that Phil mentions.
> Contact me
> >at the SMTA for more information.
> >
> >-David
> >
> >At 09:10 AM 6/25/98 EDT, you wrote:
> >>Hi Jon -
> >>If you check out my website (www.ITM-SMT.com) under "Articles", you
> will see
> >>an article I did on Reflow of Through-hole (Intrusive Reflow).  Hope
> this
> >>helps.
> >>Regarding design guidelines for fine-pitch - I recommend Vern
> Solberg's
> >design
> >>guideline book as well as Jim Blankenhorn's (from SMTPlus).  But if
> you
> >have a
> >>solderball problem, there can be a dozen causes other than the
> stencil
> >>aperture.  Improper reflow profile, bad solder paste, are among the
> myriad of
> >>causes of solder balls.  Bridging is the same - check out the
> stencil design
> >>but be more concerned about the solder paste and printing process
> and printer
> >>parameters.
> >>With the MELF, there is an aperture design that is somewhat "U"
> shaped that
> >>cradles the MELF in the solder paste.  Your stencil designer should
> know
> >about
> >>this.
> >>Hope this helps.
> >>
> >>Phil Zarrow
> >>ITM, Inc.
> >>Durham, NH  USA
> >>www.ITM-SMT.com
> >>
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