TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jeff Hempton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jun 1998 11:17:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (131 lines)
     Ed,
       I have 37 articles, a few power-point presentations, and 9 different
     spreadsheets I use for calculating intrusive reflow stuff. Now, we
     could either spend half of our day at the fax machine, or give a quick
     reference to some good and readily available resources that provide
     good starter material.
       You were correct when you stated the forum is about helping each
     other, but let's keep it as painless as possible.
       BTW, I have Jim Blankenhorn's book, and it comes with excel
     spreadsheets.Regards!


______________________________ Forward Header __________________________________
Subject: Re: [TN] intrusive reflow and all
Author:  Eddie Brunker <[log in to unmask]> at Internet
Date:    6/25/98 3:59 PM


Now this is direct selling!!!

Why are we reccommending some books to this man anyway, why don't we just
help him out with the info. he needs. Isn't that what this forum is all about?


At 09:28 25/06/98 -0500, you wrote:
>We sell the Solberg and Blankenhorn books that Phil mentions.  Contact me
>at the SMTA for more information.
>
>-David
>
>At 09:10 AM 6/25/98 EDT, you wrote:
>>Hi Jon -
>>If you check out my website (www.ITM-SMT.com) under "Articles", you will see
>>an article I did on Reflow of Through-hole (Intrusive Reflow).  Hope this
>>helps.
>>Regarding design guidelines for fine-pitch - I recommend Vern Solberg's
>design
>>guideline book as well as Jim Blankenhorn's (from SMTPlus).  But if you
>have a
>>solderball problem, there can be a dozen causes other than the stencil
>>aperture.  Improper reflow profile, bad solder paste, are among the myriad of
>>causes of solder balls.  Bridging is the same - check out the stencil design
>>but be more concerned about the solder paste and printing process and printer
>>parameters.
>>With the MELF, there is an aperture design that is somewhat "U" shaped that
>>cradles the MELF in the solder paste.  Your stencil designer should know
>about
>>this.
>>Hope this helps.
>>
>>Phil Zarrow
>>ITM, Inc.
>>Durham, NH  USA
>>www.ITM-SMT.com
>>
>>################################################################
>>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>>################################################################
>>To subscribe/unsubscribe, send a message to [log in to unmask] with
>following text in the body:
>>To subscribe:   SUBSCRIBE TechNet <your full name>
>>To unsubscribe:   SIGNOFF TechNet
>>################################################################
>>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
>information.
>>For technical support contact Hugo Scaramuzza at [log in to unmask] or
>847-509-9700 ext.312
>>################################################################
>>
>>
>
>David Gonnerman
>Director of Publications
>
>Plan now to attend:
>Surface Mount International (San Jose, CA; 8/23-8/27;
>http://www.surfacemount.com)
>Electronics Assembly Expo (Providence, RI; 10/24-10/29; http://www.ipc.org)
>
>SURFACE MOUNT TECHNOLOGY ASSOCIATION
>             Enabling members to achieve success
>        in surface mount and companion technologies
>    through education, training and access to knowledge.
>
>5200 Willson Road, Suite 215, Edina, MN  55424-1343
>           612-920-7682  F 612-926-1819
>               [log in to unmask]   www.smta.org
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>################################################################
>
>
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text
in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700
ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2