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June 1998

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Subject:
Re: Fab: plug vias
From:
"Blanchet, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jun 1998 10:10:14 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines) 
LPI

Richard Blanchet
Process Engineer, screening
Viasystems Canada Inc.
tel.: (514) 694-8900, ext. 4189
fax: (514) 694-9776
[log in to unmask]

> -----Original Message-----
> From: Afri Singh [SMTP:[log in to unmask]]
> Sent: 23 juin, 1998 18:49
> To:   TechNet E-Mail Forum.; Blanchet, Richard
> Subject:      Re: [TN] Fab: plug vias
>
> Is this thermal,UV or LPI ink ?
>
> On Tue, 23 Jun 1998, Blanchet, Richard wrote:
>
> > Hello,
> >
> > If the solder mask in the vias has been cured (full plug), is there
> any
> > way to remove it without damaging the boards ?  There's no solder
> mask
> > on the surface beside in the vias. Thanks.
> >
> >
> > Richard Blanchet
> > Process Engineer, screening
> > Viasystems Canada Inc.
> > tel.: (514) 694-8900, ext. 4189
> > fax: (514) 694-9776
> > [log in to unmask]
> >
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