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June 1998

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Subject:
From:
Dennis Maggi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Jun 1998 13:50:21 EDT
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The technologies for Future Electronic Modules and Electronic Assemblies is
HERE and NOW!

On Tuesday and Wednesday, June 10th and 11th CCA will be sponsoring a "High
Density Interconnection Electronic Modules and Assemblies" Workshop in San
Jose, California.  You should have received information on this important
workshop in the mail but incase you missed it here is your opportunity to
register for this important event.

Our biggest challenge is to get smaller!  As the boom in portable, consumer
electronics grows, the pressure to shrink conductor widths, land pattern
geometries and hole sizes also continues.  This workshop provides an overview
of the technology involved in high-density interconnection.  This program will
be an interactive exchange of ideas on design, materials, fabrication,
assembly and test procedures.

Dieter Bergman and Foster Gray will moderate this two day workshop.  With over
42 years in the industry they will be able to provide attendees with a wealth
of knowledge regarding all facets regarding HDI.

To receive a complete brochure on this conference please call CCA at (714)
730-4586 and speak with Dennis Maggi, but don't wait as time will pass you by
and so with this opportunity to learn more about HDI.

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