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June 1998

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Thu, 25 Jun 1998 09:10:37 EDT
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Hi Jon -
If you check out my website (www.ITM-SMT.com) under "Articles", you will see
an article I did on Reflow of Through-hole (Intrusive Reflow).  Hope this
helps.
Regarding design guidelines for fine-pitch - I recommend Vern Solberg's design
guideline book as well as Jim Blankenhorn's (from SMTPlus).  But if you have a
solderball problem, there can be a dozen causes other than the stencil
aperture.  Improper reflow profile, bad solder paste, are among the myriad of
causes of solder balls.  Bridging is the same - check out the stencil design
but be more concerned about the solder paste and printing process and printer
parameters.
With the MELF, there is an aperture design that is somewhat "U" shaped that
cradles the MELF in the solder paste.  Your stencil designer should know about
this.
Hope this helps.

Phil Zarrow
ITM, Inc.
Durham, NH  USA
www.ITM-SMT.com

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