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June 1998

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Subject:
Re: Soldermask flaking in immersion gold process
From:
"Coleman, Rob" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Jun 1998 07:33:14 -0500
Content-Type:
text/plain
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text/plain (44 lines) 
Most LPI suppliers now provide different catalyst that are more chemically
resistant to immersion gold process. Contact your supplier for specific
catalyst.
-----Original Message-----
From: Keith Baverstock <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, June 25, 1998 5:05 AM
Subject: [TN] Soldermask flaking in immersion gold process


>Can anyone help...
>
>It is well known that LPI soldermask can be problematic when put through
>immersion nickel/gold process.
>
>What 'fixes' are being used?
>
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