Hi. TechNetters!
Thank you all for your reply!
As you see, everybody has his reasons to apply it or not.
I would like to extend my question to those who specify electroless
AU/NI on the smt pads.
Depending on artwork and plating process control of different PCB
vendors, we have seen
shadow plating on the base material and solder mask ONLY on the 16 mil
-which is the smallest we have right now.
1.When shadow plating extends so much, is it possible that it
contributes to shorts ?
2.Without the dam, there is no shadow plating, but will we expect
difficulties in our assembly
process?
3.Do we play safe by changing the artwork for 16mil pitch GOLD FINISH?
Thank you,
Gaby

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