Hi!

I would like to ask for an effective stencil aperture design for
fine-pitch ICs. We are encountering some solder bridging on these
ICs. Also, there are solder balls present beside these components.
Do you have any stencil design guidelines that you could share with
us to improve our Screen Print Process?

Also, Are you familiar with intrusive reflow? Can anyone share some
informaiton about this?

We also have a product that uses a MELF SMD resistor. The problem
that we are encountering is that this component rolls during solder
paste curing. So when it comes out, the component is already
misaligned. Do you have any suggestions to control this without using
any fixtures?

Thanks.

Regards.
Jon Cruz
Electronic Assemblies Inc.
Manila, Philippines
e-mail: [log in to unmask]
Tel #: 823-7317/7593885
Fax #: 7538629

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