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June 1998

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Wed, 24 Jun 1998 18:39:48 -0600
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     First I will assume that since this assembly is Through hole you don't 
     have terminations  less than .020 in.( 5.3.7.4) If the solder ball 
     cannot be seen at 4X inspection it is not rejectable. 2000A requires 
     4X inspection with 10 power to be used for referee and identification 
     of the DEFECT identified at 4 power, if what you have seen is not 
     CLEARLY rejectable 2000A says it shall be accepted.(4.3.1) Since you 
     cannot see the solder balls at 4 power you do not have a defect.   


______________________________ Reply Separator _________________________________
Subject:      Re: [TN] Mil-Std-2000A Question
Author:  MIME:[log in to unmask] at INTERNET
Date:    6/24/98 5:26 PM


        My first response would be that MIL-STD-2000 no longer exists.
It has been superceded for quite a while now by industry standards such 
as IPC610 and ANSI-J. Those standards will state that if they do not 
violate conductor spacing and are firmly attached (which conformal would 
do a good job of), they are not a reject....
     
> -----Original Message-----
> From: Kenny Bloomquist [SMTP:[log in to unmask]] 
> Sent: Wednesday, June 24, 1998 5:08 PM
> To:   [log in to unmask]
> Subject:      [TN] Mil-Std-2000A Question 
>
> Here is another one of those sticky DOD questions. We have an 
> assembly, TH,
> Mil-Std-2000A, that has been through assembly, test and conformal coat 
> (UR). As it was being plugged into an end item the operator noticed a 
> solder ball. How it was seen I'll never know because I can not see it 
> through a four power glass. That aside, under a microscope we were
> able to
> find 10 or 12 "tiny" solder balls. None of them reduced the conductor 
> with
> below an acceptable spacing and all of them are encapsulated in 
> conformal
> coat.
>
> Mil-Std-2000A - Paragraph 4.21.4 "Cleanliness of printed wiring, 
> boards and
> assemblies. Printed wiring, boards and assemblies shall be free of 
> foreign
> matter. This includes grease, silicones, flux residue, dirt, chips, 
> SOLDER
> BALLS, insulation residue and wire clippings." 
>
> My sensible self tells me that since these solder balls (micro-size) 
> do not
> reduce the conductor spacing and they are encapsulated in UR that we 
> will
> do more damage reworking these than leaving them alone. I would think 
> that
> this is a process indicator and not a real defect. 
>
> The Question: Does anyone out there in TechNet land have the 
> specmanship to
> work through this or am I all wet? 
>
> Thanks in advance for all responses. 
>
> Ken Bloomquist
> Sr. Principal Process Eng.
> PRIMEX Aerospace Company
> [log in to unmask]
> (425) 881-8990 ext. 6645
>
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