I have recently gone to work with a company who is doing SMA assembly to
PWB's which have gold plated traces and pads.  This is a historical concept
as we have both ceramic and PWB substrates.  In some products, there is
direct wirebonding to the pads, and hence some thick gold plating is
required.  However, if there is no wirebonding to the board, is there any
other reason this would be preferable to conventional lead/tin plating?  I
would like to change the solder process from using a 2% silver solder used
as a result of the gold plating to a conventional Sn63 eutectic solder as a
guard against disturbed connections.  Secondarily, what is the chemical
action which makes the 2% silver solder more effective on gold plating?

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