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June 1998

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Subject:
Re: Solder mask between fine pitch pads
From:
"John Haman Jr." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Jun 1998 13:29:47 -0400
Content-Type:
text/plain
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text/plain (55 lines) 
Gaby,

Results shown on 16 and 20 mil pitch devices assembled in our 5 assembly
houses with soldermask dams has greatly reduced the number of solder
shorts.
As the manufacturer of the boards for these houses all product with these
smt's
now get 100% dams.

John Haman Jr.


----------
> From: Gabriela Bogdan <[log in to unmask]>
> To: [log in to unmask]
> Subject: [TN] Solder mask between fine pitch pads
> Date: Wednesday, June 24, 1998 11:09 AM
>
> Hi, TechNetters!
> Could you please share with me your experience about pro and con's
> regarding solder mask
> between fine pitch-16mil- pads in relation to the finish of the PCB pads
> ?
> Not being greedy, I'll save the next question for after some answers.
> Thank you,
> Gaby
>
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