Hi Bill,
On the inappropriate NASA testing you may look at: Engelmaier, W.,
"Environmental Stress Screening and Use Environments - Their Impact on Solder
Joint and Plated-Through-Hole Reliability," Proc. Int. Electronics Packaging
Conf. (IEPS), Marlborough, MA, September1990, p.388; also in Proc. 15th Ann.
Electronic Manufacturing Seminar, China Lake, CA, February 1991, pp. 253-269;
also in Proc. NEPCON West ‘91, Anaheim, CA, February 1991, pp. 67-80;.  There
are some JPL and NASA/Unisys GreenBelt reports on the subject of the solder
joint failures: Ross, R. G., "Magellan/Galileo Solder Joint Failure Analysis
and Recommendations," JPL Publication 89-35 Galileo Report 1625-429, Jet
Propulsion Laboratory, Pasadena, CA, September 15, 1989 and Evans, J., "Solder
Joint Fatigue Analysis Fairchild Remote Interface Units," Goddard Space Flight
Center Evaluation Report, Serial No. 03347, September 8, 1989. the exact
references I do not have handy since I am on the road.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask] 


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