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June 1998

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Subject:
Low-melt solder alloys for desoldering
From:
Tenison Stone <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Jun 1998 07:15:50 -0500
Content-Type:
text/plain
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text/plain (25 lines) 
Hi everyone,

I would like your opinions and experiences using low-melt solder alloys for
rework of smd.  The mixture contains tin, lead, and bismuth.  What
potential problems are associated with this combination?

Thank you for your help.

Tenison Stone
Telex Communications
Blue Earth, MN
507-526-3205

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