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June 1998

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Subject:
From:
Andy Slade <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Jun 1998 07:35:13 -0400
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     Hi Richard,
     We have had some success with laser ablating mask from via holes.
     This can be a bit challenging at set up, and not 100% successful.
     Success depends on thickness, mask type, aspect ratio, surrounding
     feature size, etc.  We have managed to saved a fair number of boards
     destined for the dumpster this way.  I am assuming this is a thermoset
     epoxy mask vs. LPI.  LPI's can generally be chemically stripped.

     Hope this helps...Andy Slade


______________________________ Reply Separator _________________________________
Subject: [TN] Fab: plug vias
Author:  "Blanchet; Richard" <[log in to unmask]> at SMTPLink-Hadco
Date:    06/23/98 4:19 PM


Hello,

If the solder mask in the vias has been cured (full plug), is there any
way to remove it without damaging the boards ?  There's no solder mask
on the surface beside in the vias. Thanks.


Richard Blanchet
Process Engineer, screening
Viasystems Canada Inc.
tel.: (514) 694-8900, ext. 4189
fax: (514) 694-9776
[log in to unmask]

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