TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Jun 1998 08:41:06 +1000
Content-Type:
text/plain
Parts/Attachments:
text/plain (77 lines)
Jerry ;
this task is quite possible using reflows with bottom temp chilling ;
up to some 30'C differentiation can be achieved ; therefore keeping you
below liquidus on second pass on bottom side .
Sorry to disappoint you , however if you do not have reflow rigged with
chiller you still have a pretty good excuse .

Paul Klasek
http://www.resmed.com

> ----------
> From:         Jerry Cupples[SMTP:[log in to unmask]]
> Sent:         Wednesday, 24 June 1998 8:15
> To:   [log in to unmask]
> Subject:      [TN] ASSY: BGA sanity check
>
> Hello, TechNet....
>
> Soldering (inline convection furnace) BGA's on both sides of a board
> is
> beyond my own experience, but it seems to violate a principle (at
> least an
> imaginary one) related to the controlled collapse, or perhaps liquids
> under
> tension.
>
> For a board design using 3 commercial BGA packages (PBGA 256, eutectic
> balls on 1.27 mm pitch), am I obstinately blocking the path of
> progress by
> requesting that this package style be confined to only one surface of
> a new
> board design?
>
> If you are doing this today and it is a piece of cake, go ahead and
> brag;
> but I would prefer to hear that caution is well advised, i.e. tales of
> misery, shame and corporate disaster resulting from such mistakes. ;-)
>
>
> cheers,
>
>
>
>
> Jerry Cupples
> Interphase Corporation
> Dallas, TX USA
> http://www.iphase.com
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
> additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2