Hello, TechNet....

Soldering (inline convection furnace) BGA's on both sides of a board is
beyond my own experience, but it seems to violate a principle (at least an
imaginary one) related to the controlled collapse, or perhaps liquids under
tension.

For a board design using 3 commercial BGA packages (PBGA 256, eutectic
balls on 1.27 mm pitch), am I obstinately blocking the path of progress by
requesting that this package style be confined to only one surface of a new
board design?

If you are doing this today and it is a piece of cake, go ahead and brag;
but I would prefer to hear that caution is well advised, i.e. tales of
misery, shame and corporate disaster resulting from such mistakes. ;-)


cheers,




Jerry Cupples
Interphase Corporation
Dallas, TX USA
http://www.iphase.com

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