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June 1998

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Subject:
From:
"by Dr. Eden Chen XianSong" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Jun 1998 17:28:51 +0800
Content-Type:
text/plain
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cc:Mail (27 lines)
     Dear member,

     I am going to do FEM simulation for our electronic packaging. There
     are several software in the market, such as ANSYS, MARK, ABACUS and
     Pro-mechanical. From your experience, which one is better?

     I need to simulate the nonlinear material and very fine structure such
     as wire and  adhesive.

     Pls. give me some advice.

     Best Regards

     Eden

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