I think you'll find that the mechanical action of your in-line cleaning
system, rather than chemical reaction, is the primary cause of marking
removal.  Are the markings intact on the bottom of the part, away from the
high-pressure jets?  We have found certain glass body diode vendors
occasionally have marking adhesion problems.  Military and commercial.
Sometimes we can correct the problem by baking the parts prior to assembly,
sometimes not.  BTW, we use Armakleen and a Trieber in-line system.

At 09:02 AM 6/1/98 -0500, Steven H Axdal wrote:
>  I'm looking for pointers to information on how to clean RMA flux from
>  circuit boards.  We're doing contract assembly and the design currently
>  specifies RMA flux.  (Build specs are basically WS-6536 and Mil-Std-2000,
>  NOT 2000A or J-Std) We've got an in-line aqueous system (using Armakleen
>  detergents) in place, but it's removing markings from diodes (and the
>  markings are required to be readable).  We've also been using a solvent
>  vapor system (AK-225), but it's attacking the adhesive bonding heatsinks
>  to the boards.
>
>  Anybody care to make suggestions for RMA flux cleaning approaches or
>  pointers to likely candidates for a)information or b)product
>  representatives?
>
>  Thanks
>  Steven Axdal
>  General Dynamics Information Systems
>  [log in to unmask]             612-853-3830

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