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June 1998

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Subject:
From:
Ricky Javier <rjavier@[192.1.1.215]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 22 Jun 1998 13:32:43 +0000
Content-Type:
text/plain
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text/plain (33 lines)
Hello everybody,

We are processing chip-on-board devices and want to conduct die shear
sampling test before wirebond , The specs should conform with the
Mil.Std-883 D but unfortunately I don't  have the hardcopy of it
for my reference . Actually we already placed an order for this one
but according to our purchaser Mil.Std.-883D is out of the market.
Could anyone can help us on how we can get a copy of it so that we
can follow / implement the specs in our process once we required
by our customer . I understand that for every die size there should
have a corresponding die shear limit and that is what we are missing
right now .  I want to give you some die sizes : 68 x 74 ,151x137
,235x173 mils,

 Your help is highly appreciated,Thank you very much.


Regards

ricky

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