Dear Technet,

Fact or Fiction?

Being a relic of military electronics assembly, I have always dealt with
ceramic-encased microcircuits.  As we're starting to look at plastic
encapsulated microcircuits (PEMs), some new assembly considerations
arise.  One that we (technet) have covered lately is the moisture
absorption, which I can understand.  Another concern that my folks are
telling me is that these PEMs are subject to corrosion when soldered
with rosin-based fluxes, even the RMA types, regardless of cleaning
processes.  Other no-clean or water soluble fluxes are ok.  I am having
trouble with this one.  Can anyone support or deny this notion?

Thanks

Ralph

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