TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Lenny Kurup <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Jun 1998 15:37:01 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (22 lines)
The ammoniacal etchant must be controlled very closely  during the
etching cycle, remember most ammoniacal etchants carry chlorides, what is
happening is attack of the nickel under the gold
via the side walls, leading to a weakened gold layer, resulting in peeling.

Good Luck
Lenny Kurup
EMX Enterprises Ltd
Markham, Ontario

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2