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June 1998

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Subject:
From:
"Modular Components National, Inc." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Jun 1998 14:14:12 -0400
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        Thank you for the responses we've received to our question on ultrasonic
cleaning.  However, the question was worded poorly and also did not cover
the topics we wanted it to.  So we're going to give it a second go.
        Lately, we have experienced some problems with gold to nickel adhesion.
We are using nickel/gold plating as an etch resist for an ammoniacal
etcher.  The parts have a dry film image placed on them prior to plating.
Immediately following nickel/gold plating, the parts are tape tested.  They
are then sent to have the dry film removed and then etched.  Following the
etching process they are again tape tested.  Occasionally, the first tape
test will produce gold peeling, and the job gets reworked then.  Most of
the time, however, the gold holds up through the first tape test, and most
adhesion problems that we have don't show up until after etching.  It also
seems to happen more frequently on TMM material then on others.
        Any suggestions you may have would be a great help to us.

Thank you
Ryan
Modular Components National, Inc.
2302 Industry Court
Forest Hill, MD 2150
PH (410) 879-6553
Fax (410) 838-7629

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