TECHNET Archives

June 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Overplated blind via's
From:
Kent Johnson <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 18 Jun 1998 07:59:39 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (66 lines) 
Mark,

You have a valid concern.  This type of construction requires some skill
and experience to produce reliable boards.

FYI, we have built in excess of $1 million of this type of product, to
IPC-RB-276 Type 4 Class 3 specs, for flight hardware (source inspected).

The majority of these boards were 15 layer, with blinds from layer 1-14,
and also 12 layer with blinds from 1-10.  The hole diameter was typically
.010, so getting proper resin fill was a challenge.  They were then plated
over.

I'll be glad to talk with you about this further.

Kent Johnson
UNICIRCUIT
Phone: 800-648-6449

On Tuesday, June 16, 1998 1:23 PM, [log in to unmask] [SMTP:[log in to unmask]]
wrote:
> Hello Technet,
>
> Our company is busy designing some printed circuit boards with
> "overplated blind via's" (I mean blind via's, made in a sequential
> plating process, where the via is filled with epoxy, after which it is
> covered with copper and a solderable plating).
> All our vendors claim they can build such boards, but as far as I
> known they do not use this technology very often,  and I don't want to
> be their "guinea pig".
> The question :
> What kind of questions should I ask our bare board vendors in order to
> check wether they are capable of building these boards with good
> relaibility in a reproducible way ? What are the potential problems
> that the board vendors should be aware of, and should have solved ?
> Any ideas ?
>
> Mark Roach
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
> ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2