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June 1998

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Subject:
From:
"Nelson, John" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 Jun 1998 07:48:15 -0400
Content-Type:
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text/plain (49 lines)
In a previous life I was instrumental in switching processes from
scrubbing with a compressed
wheel to a no-scrub process.  I had very little confidence in the
quality of the rinsing and drying
from the plating process so I installed a clean line that consisted of a
four foot, high pressure
chamber with citric acid followed by three chambers with cascading water
rinse.  Each chamber
had over 30 psi on fan nozzles.

The citric is a fair antitarnish and has the advantage of being cheap.
It must be dumped daily
to prevent the buildup of bacterial slime.  Perhaps the most important
part of the process was
the high pressure rinsing.  This is needed to remove any loose particles
of copper from around
the edges of the panels.  These particles are copper or copper coated,
totally opaque to light and
and if not removed before the imaging process will ruin yields.

> -----Original Message-----
> From: Jacob Ransborg [SMTP:[log in to unmask]]
> Sent: Wednesday, June 17, 1998 7:05 PM
> To:   [log in to unmask]
> Subject:      [TN] Cleaning Process after Electroless copper
> Hi technetters
> I would like to hear if anybody have experience wtith a cleaning
> process of
> PCB-boards after plating with electroless copper. Does anybody brush
> the
> boards or use a chemical treatment etc.
>
> Regards
> Jacob Ransborg
>
>

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