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June 1998

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Subject:
Re: Cleaning Process after Electroless copper
From:
Fulabhai Patel <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 17 Jun 1998 22:38:08 -0700
Content-Type:
text/plain
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text/plain (67 lines) 
Depends upon  topography retained after elecroless copper,
 1. Neutralise, rinse, scrubb , dry
 2. Neutralise, rinse, antitarnish,dry
 3. Neutralise , rinse, light pumise scrubb on machine,dry

Final surface must be clean, uniform , acidic , dry

Fulabhai Patel         [log in to unmask]




[log in to unmask] wrote:
>
> Jacob Ransborg wrote:
> >
> > Hi technetters
> >
> > I would like to hear if anybody have experience wtith a cleaning process of
> > PCB-boards after plating with electroless copper. Does anybody brush the
> > boards or use a chemical treatment etc.
> >
> > Regards
> >
> > Jacob Ransborg
> >
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> > ################################################################Jacob,
> Most electroless copper deposits are fairly rough in terms of topography
> and generally provide an excellent surface for dry film adhesion.
> Generally, no precleaning after electroless is required if you are going
> directly to imaging.(assume hold times between electroless and
> photoresist lamination is less tha eight hours)
> Depending on deposit thickness, scrubbing is  not recommended anyway.
> Good luck.
>
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