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June 1998

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Subject:
Re: SMT Reliability
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TechNet E-Mail Forum.
Date:
Thu, 18 Jun 1998 00:42:05 EDT
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Besides current capacities, I would use a low thermal-capactitive iron (like a
Metcal) to do the hand assembly since temperature shock can be a big factor
with smaller chip components...especially the capacitors.

I cannot back the following statement up quantitatively, but the larger solder
wall that the 0603 component sees due to the larger 0805 solder pad can cause
higher stresses in the component since the joint becomes less compliant during
thermal excursions.  This could lower reliability.

Frank

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