Hi Scott

Are you baking both types of parts when they have accumulated the
recommended open time? Are you tracking open time? I'm very curious as to
what procedures you're following, especially if you're baking tape/reel parts.

At 01:19 PM 6/17/98 -0600, you wrote:
>Either tray or tape and reel.
>
>-----Original Message-----
>From: Jeff Guynn [mailto:[log in to unmask]]
>Sent: Wednesday,June 17,1998 12:59 PM
>To: [log in to unmask]
>Subject: Re: [TN] Moisture sensitive SMD-ICs
>
>
>Scott: how are your MSD parts packaged? Tray? Tape/reel? Tubes?
>
>At 11:09 AM 6/17/98 -0600, you wrote:
>>Or, you could vacuum pack them with silica! (this is what we do)
----

Jeffrey C. Guynn <[log in to unmask]> Phone: (219) 429-6345
Lead SMD Manufacturing Engineer        Fax: (219) 429-4688
Raytheon Systems Company M/S 25-31
1010 Production Road, Fort Wayne, IN 46808-4106

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