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| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 17 Jun 1998 10:41:15 -0500 |
| Content-Type: | text/plain |
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Agreed. I didn't mention crack initialization, due to
the fact we discovered that this generally only happened when personnel
left the assembled product in the cleaner for a long period of time. (1
hour plus.)
Cobey
-----Original Message-----
From: Joy, Stephen C
[SMTP:[log in to unmask]]
Sent: Wednesday, June 17, 1998 10:34
AM
To: [log in to unmask]
Subject: Re: [TN] Ultrasonic
cleaning
I have seen issues with crack initiation in
assembled solder joints in some
cases. Ultrasonic cleaning after x section
cutting has been statistically
confirmed as the culprit.
What you may be seeing are Ni oxidation effects.
Maybe the ultrasonic cleaner is a potential
process control tool!
Steve
In my experience, the only problems observed
with this
cleaning method is getting a cleaning solution
that will not leave a
nasty residue. If rinsed and dried properly, we
have no defects.
Cobey Schmidt
VisionTek
1175 lakeside Drive
Gurnee, IL 60031
[log in to unmask]
<mailto:[log in to unmask]>
(847) 360-7566 voice
(847) 360-7443 fax
-----Original Message-----
From: Modular Components National,
Inc. [SMTP:[log in to unmask]]
Sent: Wednesday, June 17, 1998 9:19 AM To:
[log in to unmask]
Subject: [TN] Ultrasonic cleaning
To all:
Are there any negative effects to using
ultrasonic cleaning on nickel/gold
plating?
My reason for asking is this. We recently
plated two panels and tape
tested them prior to ultrasonic cleaning. Then
after ultrasonic cleaning
and during our final machining process, we
experienced poor gold to nickel
adhesion.
Any input would be greatly appreciated.
Regards
Ryan
Modular Components National, Inc.
2302 Industry Court
Forest Hill, MD 2150
PH (410) 879-6553
Fax (410) 838-7629
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