Mark,
We are manufacturing blind vias using such technology . As a manufacturer of
such boards , the only " special " precaution is related to plated copper
thickness in such blind via . Rest of problems are related to whole range of
dense multilayers , nothing exceptional .
This technology is not used very often , because people don`t like addition
production stages , design and registration problems .
Apart of your standard " new supplier source " you should ask question
regarding process flow for blind and burried vias , QC procedures , general
characteristics regarding production capability ( via diameters , number of
layers , line width and spacing etc ) , and the most importand , existing
yield data and scrap characteristics regarding blind and burried PCB .
Regards
At 19:22 16/06/98 GMT, you wrote:
>Hello Technet,
>
>Our company is busy designing some printed circuit boards with
>"overplated blind via's" (I mean blind via's, made in a sequential
>plating process, where the via is filled with epoxy, after which it is
>covered with copper and a solderable plating).
>All our vendors claim they can build such boards, but as far as I
>known they do not use this technology very often, and I don't want to
>be their "guinea pig".
>The question :
>What kind of questions should I ask our bare board vendors in order to
>check wether they are capable of building these boards with good
>relaibility in a reproducible way ? What are the potential problems
>that the board vendors should be aware of, and should have solved ?
>Any ideas ?
>
>Mark Roach
>
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Edward Szpruch
Eltek Ltd - Israel
Tel 972 3 9395050
Fax 972 3 9309581
E-mail : [log in to unmask]
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