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June 1998

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Subject:
Re: Components - Exposed Cu on Component Lead Ends
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 16 Jun 1998 17:19:31 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (68 lines) 
Hi Rob - here is the paper you are looking for:

"Effects of Operating Environments on Migration of Copper on Printed Wiring
Boards", May 1989, author W.H. Abbott, Battelle

I also have a paper that documents a 30 year study of exposed copper in the
Telecommunications industry but can't find it in my files - I'll post it
when I find it.  Happy reading.

Dave Hillman
Rockwell Collins
[log in to unmask]





Rob Schetty <[log in to unmask]> on 06/05/98 01:00:10 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Rob Schetty <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] Components - Exposed Cu on Component Lead Ends




Can anyone direct me to a technical reference detailing the work done to
show that exposed copper on component lead ends do not pose a solderability
problem?

I've searched the Technet Archives but only found vague references to a
Battelle paper with no further details.

Thanks in advance for any responses.

Rob Schetty
LeaRonal Inc
Freeport NY  USA

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